Ho paka
Re fana ka boleng bo holimo ka ho fetisisa, ba pakiloeng ka theko e phahameng ka ho fetisisa ea moruo e fumanehang. Ka ponaletso ea leseli ea 40%, e iponahatsa e le pontšo ea li-IC's (li-circuits tse kopaneng) le li-PCB (li-boardcircuit board). Ts'ireletso ea tšepe e tšoarellang ho feta e patiloeng e fa FaradayCage ts'ebetso e hlokahalang ho sirelletsa likonteraka tsena khahlano le li-tuli.
Lihlahisoa tsohle li tla paka ka anti-tuli. Tsamaisa ka ts'ireletso ea antistatic ea ESD.
Ntle le tse fumanehang ka har'a lipakatso tsa ESD li tla sebelisa leseli la rona: Karolo ea Motsoako, Brand le Boholo.
Re tla hlahloba thepa eohle pele re tsamaisoa, re netefatsa hore lihlahisoa tsohle li maemong a matle mme re netefatse hore likarolo ke litheolelo tse ncha tsaalmalmatch.
Kamora hore thepa eohle e netefatse hore ha e na mathata ka mor'a ho paka, re tla e paka ka mokhoa o sireletsehileng mme ra romella ka polelo ea lefats'e. E bontša ho phunya le ho hanyetsa likhapha hammoho le botšepehi bo tiileng ba tiiso.
Re ka fana ka ts'ebeletso ea ho fana ka litšebeletso lefatšeng ka bophara, joalo ka DHLor FedEx kapa TNT kapa UPS kapa e mong ea fetisang thepa pele.
Tsamaiso ea Lefatše ka bophara ke DHL / FedEx / TNT / UPS
Litefiso tsa Shipping DHL / FedEx
1). O ka fana ka akhaonto ea hau ea tlhahiso ea thepa bakeng sa ho romelloa, haeba u se na ak'haonte efe kapa efe ea ho romella thepa, re ka fana ka tlaleho ea inadvance ea rona.
2). Sebelisa ak'haonte ea rona bakeng sa ho romella thepa, Tefo ea Thomello (Reference DHL / FedEx, linaha tse fapaneng li na le theko e fapaneng.)
| Litefiso tsa thomello :: |
(Reference DHL le FedEX) |
| Boima (KG): 0.00kg-1.00kg |
Theko (USD $): USD $ 60.00 |
| Boima (KG): 1.00kg-2.00kg |
Theko (USD $): USD $ 80.00 |
* Theko ea litšenyehelo e bontšoa ho DHL / FedEx. Lintlha tse qotsitsoeng, ka kopo ikopanye le rona. Naha e fapaneng liqoso tse hlahisitsoeng ke tse fapaneng.
- Tsela e 'Ngoe ea ho Romela: SF Express bakeng sa Asia; Ching-woo e khethehileng ea moea bakeng sa Korea, linaha tsa Aramexfor Middle East. Tsela e 'ngoe ea ho romella, ka kopo ikopanye le rona.
Re ka boela ra romella thepa ho motho ea e romelang ka pele kapa ho motho e mong eo u mo romellang eona, e le hore u ka romella thepa eo hammoho. E kanna ea u bolokela thepa, kapa ea u nolofalletsa.
- Lintlha tsa Tsamaiso: Shippinginformation, Re hloka tlhaiso-leseling e kenyelletsoang ho kenyelletsa Lebitso la K'hamphani ea Receiver (Kapa ea motho), Lebitso la kamohelo, Nomoro ea ho ikopanya, Aterese le Zip Code. Ka kopo netefatsa tlhahisoleseling ena, e le hore re ka hlophisa thomello kapele.
- Nako ea thomello: Nako ea ho tsamaisa e tla hloka 2-5days ho boholo ba naha lefats'e ka bophara bakeng sa DHL / UPS / FEDEX / TNT.
MX0505S250 Lintlha tsa sehlahisoa:
MX0505S250 IGBT Modules: Meeting Demands of High-Power Applications with Precision
MX0505S250 is a highly reliable and efficient Discrete Semiconductor Product designed to cater to the high-power application requirements. This IGBT module is uniquely designed to provide precision and reliability, making it ideal for use in a wide range of industries, including renewable energy, electric vehicles, welding machines, power factor correction, and more.
With an output voltage of 250V and current of 5A, the MX0505S250 module features excellent performance parameters such as high accuracy, efficiency, and temperature range. The advanced torsional and polyamide technology used in its construction makes it highly durable.
The MX0505S250 is an indispensable IGBT module for electronic devices that require high power inputs, such as motor drives, inverters, and uninterruptible power supplies. Its compact size and excellent performance parameters make it a top choice for electronic device manufacturers, system integrators, and OEMs worldwide.
This IGBT module offers unmatched performance, low power loss, and fast switching speed, making it ideal for a wide range of power applications. Its high-performance capabilities make it an ideal choice for demanding applications where accuracy and reliability are essential.
Integrated circuits can further be classified into digital, analog, mixed-signal, and RF. The MX0505S250 module falls under the mixed-signal category, which is designed to handle both digital and analog signals.
The manufacturing process of this IGBT module is highly complex and involves several intricate steps, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, and vapor deposition, followed by etching and cleaning. The finished products undergo rigorous testing and packaging before being dispatched to ensure their quality.
Complete with advanced design and manufacturing capabilities, MX0505S250 IGBT Modules are designed to cater to high-power applications and meet the industry's rigorous demands. With its unique technology, superior performance, and broad application scope, the MX0505S250 is fast becoming a popular choice among designers of high-power systems.
